Copper Clad Laminate (Copper Clad Laminate, full name Copper Clad foil Laminate, English abbreviation CCL), is made of wood pulp paper or glass fiber cloth as reinforcement material, impregnated with resin, single or double sides covered with Copper foil, by hot pressing a product, known as Copper Clad foil Laminate. It is the base material of PCB, often called substrate. When it is used for multilayer production, it is also called CORE board. Commonly used copper clad plate thickness is 0.8mm, 1.0mm, 1.2mm and 1.5mm, etc.

Paper base copper-clad board according to ASTM/NEMA standard of the United States of America, the main varieties are: FR-1, FR-2, FR-3 (above for flame retardant board) and XPC, XXXPC (above for non-flame retardant board) and other types of products. Asia accounts for more than 85% of the world market for paper-based copper clad panels. Fr-1 and XPC are mainly used in PCB production in this region, while FR-2, FR-3 and XXXPC are mainly used in Europe and America and other regions.

Due to the vast majority of paper based copper clad plate production, use are in Asia, and because Japan in this type of product manufacturing technology in the world leading position, so, in the implementation of paper based copper clad plate technical standards, its authoritative standard (including performance indicators and test methods) is Japan industrial standard (IIS standard).

The most commonly used and most produced paper - based copper clad plates are FR-4 and XPC. Fr-1 plate in the United States IPC-4101 standard is no. 02 plate; In the Japanese JIS standard (C-6480-1994) PP7F. XPC board is no. 00 board in IPC-4101 standard; PP7 plate in JIS (C-6480-1994) standard.